Circuit Board Manufacturing - Company Ranking(6 companyies in total)
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| Company Name | Featured Products | ||
|---|---|---|---|
| Product Image, Product Name, Price Range | overview | Application/Performance example | |
Substrate manufacturing
Other |
【Features】 ○ Capable of manufacturing high multilayer PCBs in a short lead time ○ Capable of manufacturing high aspect ratio PCBs on dedicated in-house lines (Aspect ratio = 21.6 for a board thickness of 5.4mm and hole diameter of Φ0.25mm) ○ Surface finish of the PCB is electroless gold plating with a thickness of 1.1 to 1.5μm ○ Supports specifications for PCBs for fine pitch CSP devices ● For more details, please contact us. | For usage examples, please contact us. | |
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ピーダブルビー 草津事業所
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- Featured Products
-
Substrate manufacturing
- overview
- 【Features】 ○ Capable of manufacturing high multilayer PCBs in a short lead time ○ Capable of manufacturing high aspect ratio PCBs on dedicated in-house lines (Aspect ratio = 21.6 for a board thickness of 5.4mm and hole diameter of Φ0.25mm) ○ Surface finish of the PCB is electroless gold plating with a thickness of 1.1 to 1.5μm ○ Supports specifications for PCBs for fine pitch CSP devices ● For more details, please contact us.
- Application/Performance example
- For usage examples, please contact us.
-
ピーダブルビー 草津事業所
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